As electronic component applied in electronic industry become smaller and more expensive,temperature-sensitive assemblies demanded in this industry,we demand new and more precisely controlled laser soldering technology.
secondly,thermal-sensitive assemblies embedded with modern high tensity and electronic-optic component are used in 3-dimension circuit now,what is more,the joining process cant be achieved by conventional wave or reflow soldering technique or soldering station.
Laser soldering technology was intended to applied in soldering temperature-sensitive component and soldering those which cannot be soldered by conventional reflow technique or soldering station
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